Bhubaneswar, 18 April (H.S.): Odisha is set to mark a major milestone in India’s semiconductor journey with the groundbreaking ceremony of the country’s first Advanced Glass Semiconductor Packaging Unit, to be held in Bhubaneswar on April 19, 2026.

The project, titled Heterogeneous Integration Packaging Solutions (3D Glass Solutions), represents India’s first advanced 3D chip packaging facility and is expected to position Odisha as a key hub in global semiconductor packaging technology.

The ceremony will be attended by Chief Minister Mohan Charan Majhi, Union Minister for Electronics & IT Ashwini Vaishnaw, and Odisha Electronics & IT Minister Mukesh Mahaling, along with senior officials, global industry leaders, investors, and academic representatives.

The project is being described as a significant step toward establishing India’s presence in next-generation semiconductor manufacturing. It introduces cutting-edge 3D heterogeneous integration technology and advanced glass substrate-based packaging for the first time in the country.

According to officials, the project has an estimated investment of ₹1,943 crore and is expected to generate around 2,500 direct and indirect employment opportunities. It will have an annual production capacity of approximately 50 million assembled units.

The chips produced at the facility are expected to cater to critical sectors such as aerospace, defence, artificial intelligence, 5G communications, and data centres.

This initiative further strengthens Odisha’s growing semiconductor ecosystem, making it the first state in India to host both a compound semiconductor fabrication unit and an advanced 3D chip packaging facility based on glass substrates.

Officials said the project reflects the state government’s focus on attracting high-tech investments, building a strong innovation ecosystem, and aligning with the vision of Atmanirbhar Bharat.

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Hindusthan Samachar / Monalisa Panda